- Development hardware and reference software drivers enable time and cost savings for intelligent sensing applications
GOLETA, Calif., April 19, 2023 ― Teledyne FLIR, part of Teledyne Technologies, today released development kits for quick integration of the performance-leading FLIR Hadron 640R thermal and visible dual camera module. These hardware and reference software drivers are compatible with development boards supporting the NVIDIA Jetson Nano, the Qualcomm RB5, and the Qualcomm Snapdragon 865. The power of cutting-edge embedded systems can now be quickly unleashed by integrators opening a new world of possibilities along with time and cost savings.
The Hadron 640R features a compact 640×512 resolution radiometric Boson® thermal camera module providing the ability to see through total darkness, smoke, most fog, and glare, capturing the temperature of every pixel in the scene. The Boson is paired with a 64MP visible electro-optical (EO) camera for high definition visible imagery. The new development kits enable integrators to start imaging and controlling the cameras within just hours. This helps significantly reduce development time and costs further making it the ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and AI-ready applications where efficient battery run-time and battery life are mission-critical.
“The powerful Hadron 640R development kits provide integrators industry-leading thermal and visible camera operation using both Linux and Android application development,” said Michael Walters, vice president, product management, Teledyne FLIR. “Combined with the size, weight, and power optimized
Hadron 640R and the Teledyne FLIR technical services team to support integration, these development kits further maximize efficiency for developers at every stage.”
Details for Integrators
With low, steady-state power consumption at 1.8W and an IP-54 rating, the Hadron 640R offers extended battery operation time in a compact, lightweight 56-gram camera module. The plug-and-play development solution allows for same-day operation and comes packaged with interface boards, cabling hardware, and reference software drivers.
